09/09/2024
[Join Concurrent Technical Programmes to Stay Close to the Latest Industry Trends]
A series of concurrent Technical Programmes will be organized alongside the exhibition to help visitors better grasp the current trends and future directions. This year’s Technical Programmes include:
- Technical Forums
(1) Growth Potential of Electroplating Processing in the Military Sector
Electroplating has increasingly become critical not only in enhancing the durability and effectiveness of military equipment but also contributing to its overall stealth capabilities and electronic functionalities. The Forum will discuss the role of electroplating in the military sector.
(2) Chip Electroplating Chain Focusing on New Development in High-Ended Electroplating Technology
Electroplating process not only facilitates the creation of complex electronic circuits on a tiny chip but also significantly enhances the electrical and mechanical properties of the chips. The Forum will explore the importance and future development of electronic surface treatment techniques in chip manufacturing.
Visitors can simply scan the QR Code or visit https://d.7-event.cn/Reg/login/ccsf?show=sf&lng=en to register online. Visitor registration is also available via our official WeChat platform (ID: ChinaCoat_SFChina).
#中国国际表面处理展 #表面处理展
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